The Amlogic G12A SDIO Controller has a bug preventing direct DDR access,
add the port A (SDIO) pinctrl and controller nodes and mark this specific
controller with the amlogic,dram-access-quirk property.
Signed-off-by: Jerome Brunet <jbrunet@baylibre.com>
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
This patch adds basic support for :
- Amlogic G12B, which is very similar to G12A
- The HardKernel Odroid-N2 based on the S922X SoC
The Amlogic G12B SoC is very similar with the G12A SoC, sharing
most of the features and architecture, but with these differences :
- The first CPU cluster only has 2xCortex-A53 instead of 4
- G12B has a second cluster of 4xCortex-A73
- Both cluster can achieve 2GHz instead of 1,8GHz for G12A
- CPU Clock architecture is difference, thus needing a different
compatible to handle this slight difference
- Supports a MIPI CSI input
- Embeds a Mali-G52 instead of a Mali-G31, but integration is the same
Actual support is done in the same way as for the GXM support, including
the G12A dtsi and redefining the CPU clusters.
Unlike GXM, the first cluster is different, thus needing to remove
the last 2 cpu nodes of the first cluster.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Tested-by: Anand Moon <linux.amoon@gmail.com>
[khilman: add vin-supply for vcc_v5 as suggested by Anand Moon]
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
This enables Bluetooth support for the following models:
AP6335 in the WeTek Hub rev1 - BCM4335C0.hcd
AP6255 in the WeTek Hub rev2 - BCM4345C0.hcd
AP6330 in the WeTek Play 2 - BCM4330B1.hcd
Signed-off-by: Christian Hewitt <christianshewitt@gmail.com>
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
- Remove serial1 alias
- Add support for uart_A rts/cts
- Add bluetooth uart_A subnode qith shutdown gpio
Fixes: b8b74dda39 ("ARM64: dts: meson-gxm: Add support for Khadas VIM2")
Signed-off-by: Christian Hewitt <christianshewitt@gmail.com>
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
Enable the network interface of the X96 Mac using an external
Realtek RTL8211F gigabit PHY, needing the same broken-eee properties
as the previous Amlogic SoC generations.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
The Amlogic G12A has the hwrng module at the end of an unknown
"EFUSE" bus.
The hwrng is not enabled on the vendor G12A DTs, but is enabled on
next generation SM1 SoC family sharing the exact same memory mapping.
Let's add the "EFUSE" bus and the hwrng node.
This hwrng has been checked with the rng-tools rngtest FIPS tool :
rngtest: starting FIPS tests...
rngtest: bits received from input: 1630240032
rngtest: FIPS 140-2 successes: 81436
rngtest: FIPS 140-2 failures: 76
rngtest: FIPS 140-2(2001-10-10) Monobit: 10
rngtest: FIPS 140-2(2001-10-10) Poker: 6
rngtest: FIPS 140-2(2001-10-10) Runs: 26
rngtest: FIPS 140-2(2001-10-10) Long run: 34
rngtest: FIPS 140-2(2001-10-10) Continuous run: 0
rngtest: input channel speed: (min=3.784; avg=5687.521; max=19073.486)Mibits/s
rngtest: FIPS tests speed: (min=47.684; avg=52.348; max=52.835)Mibits/s
rngtest: Program run time: 30000987 microseconds
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
With the X96 Max board using an external Gigabit Ethernet PHY,
add the same driver strength to the Ethernet pins as the vendor
tree.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
The u200 is the main mother board for the S905D2. It can provide
both the internal and external network. However, by default the
resistance required for the external RGMII bus are not fitted, so
enable the internal PHY.
Signed-off-by: Jerome Brunet <jbrunet@baylibre.com>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
Add the g12a mdio multiplexer which allows to connect to either
an external phy through the SoC pins or the internal 10/100 phy
Signed-off-by: Jerome Brunet <jbrunet@baylibre.com>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Kevin Hilman <khilman@baylibre.com>
Armada 7040-db USB ports deliver 500mA by default while they
could deliver up to 900mA (usually, for USB3 devices).
The board embeds a GPIO controlled regulator on each port which can be
configured to deliver each amount of current.
Add a vin-supply property to the USB3 Vbus nodes for this purpose. The
regulator will be automatically 'enabled', ie. set to limit at 900mA
instead of 500mA.
Suggested-by: Alex Leibovich <alexl@marvell.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Gregory CLEMENT <gregory.clement@bootlin.com>
This patch adds a reset-cells property to the gcc controller on the QCS404.
Without this in place, we get warnings like the following if nodes reference
a gcc reset:
arch/arm64/boot/dts/qcom/qcs404.dtsi:261.38-310.5: Warning (resets_property):
/soc@0/remoteproc@b00000: Missing property '#reset-cells' in node
/soc@0/clock-controller@1800000 or bad phandle (referred from resets[0])
also defined at arch/arm64/boot/dts/qcom/qcs404-evb.dtsi:82.18-84.3
DTC arch/arm64/boot/dts/qcom/qcs404-evb-4000.dtb
arch/arm64/boot/dts/qcom/qcs404.dtsi:261.38-310.5: Warning (resets_property):
/soc@0/remoteproc@b00000: Missing property '#reset-cells' in node
/soc@0/clock-controller@1800000 or bad phandle (referred from resets[0])
also defined at arch/arm64/boot/dts/qcom/qcs404-evb.dtsi:82.18-84.3
Signed-off-by: Andy Gross <agross@kernel.org>
CoreSight DT bindings have been updated, thus the old compatible strings
are obsolete and the drivers will report warning if DTS uses these
obsolete strings.
This patch switches to the new bindings for CoreSight dynamic funnel,
so can dismiss warning during initialisation.
Cc: Andy Gross <agross@kernel.org>
Cc: David Brown <david.brown@linaro.org>
Cc: Mathieu Poirier <mathieu.poirier@linaro.org>
Cc: Suzuki K Poulose <suzuki.poulose@arm.com>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Andy Gross <agross@kernel.org>
Some ISDN files that got removed in net-next had some changes
done in mainline, take the removals.
Signed-off-by: David S. Miller <davem@davemloft.net>
Because of register and bits difference for setting PHY modes, PTP reference
clock, and FPGA signalling, the Stratix10 SoC needs to use the
"altr,socfpga-stmmac-a10-s10" binding to set the correct modes.
On Stratix10, each EMAC has its own register for PHY modes, and they all have
the same offset, thus we can use the 2nd parameter to specify the offsets
for the FPGA signal bits.
Signed-off-by: Dinh Nguyen <dinguyen@kernel.org>
The HiHope RZ/G2M sub board sits below the HiHope RZ/G2M main board.
This patch also adds ethernet support along with a dtsi common to
both HiHope RZ/G2M and RZ/G2N sub boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic support for the HiHope RZ/G2M main board:
- Memory,
- Main crystal,
- Serial console
This patch also includes a dtsi common to both HiHope RZ/G2M
and RZ/G2N main boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The RZ/G2M (a.k.a. r8a774a1) comes with two clusters of
processors, similarly to the r8a7796.
The first cluster is made of A57s, the second cluster is
made of A53s.
The operating points for the cluster with the A57s are:
Frequency | Voltage
-----------|---------
500 MHz | 0.82V
1.0 GHz | 0.82V
1.5 GHz | 0.82V
The operating points for the cluster with the A53s are:
Frequency | Voltage
-----------|---------
800 MHz | 0.82V
1.0 GHz | 0.82V
1.2 GHz | 0.82V
This patch adds the definitions for the operating points
to the SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
A single cooling device is described for all A53 CPUs as this
reflects that physically there is only one cooling device present.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A5 cooling device supports 5 cooling states which can be categorised as
follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Keita Kobayashi <keita.kobayashi.ym@renesas.com>
Signed-off-by: Gaku Inami <gaku.inami.xw@bp.renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Since the commit 233da2c9ec ("dt-bindings: phy: rcar-gen3-phy-usb2:
Revise #phy-cells property") revised the #phy-cells, this patch follows
the updated document for R-Car Gen3 and RZ/A2 SoCs.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
It is incorrect to specify the no-ether-link property for the AVB device on
the Ebisu board. This is because the property should only be used when a
board does not provide a proper AVB_LINK signal. However, the Ebisu board
does provide this signal.
As per 87c059e9c3 ("arm64: dts: renesas: salvator-x: Remove renesas,
no-ether-link property") this fixes a bug:
Steps to reproduce:
- start AVB TX stream (Using aplay via MSE),
- disconnect+reconnect the eth cable,
- after a reconnection the eth connection goes iteratively up/down
without user interaction,
- this may heal after some seconds or even stay for minutes.
As the documentation specifies, the "renesas,no-ether-link" option
should be used when a board does not provide a proper AVB_LINK signal.
There is no need for this option enabled on RCAR H3/M3 Salvator-X/XS
and ULCB starter kits since the AVB_LINK is correctly handled by HW.
Choosing to keep or remove the "renesas,no-ether-link" option will have
impact on the code flow in the following ways:
- keeping this option enabled may lead to unexpected behavior since the
RX & TX are enabled/disabled directly from adjust_link function
without any HW interrogation,
- removing this option, the RX & TX will only be enabled/disabled after
HW interrogation. The HW check is made through the LMON pin in PSR
register which specifies AVB_LINK signal value (0 - at low level;
1 - at high level).
In conclusion, the present change is also a safety improvement because
it removes the "renesas,no-ether-link" option leading to a proper way
of detecting the link state based on HW interrogation and not on
software heuristic.
Fixes: 8441ef643d ("arm64: dts: renesas: r8a77990: ebisu: Enable EthernetAVB")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: updated changelog]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Apparently this DTS crossed over with commit 31af04cd60 ("arm64: dts:
Remove inconsistent use of 'arm,armv8' compatible string") and missed
out on the cleanup, so put it right.
Signed-off-by: Robin Murphy <robin.murphy@arm.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
GIC is inside of SoC from architecture perspective, it should
be located inside of soc node in DT.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Based on 2 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 as
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 as
publishhed by the free software foundation
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 48 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190530000436.292339952@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Based on 1 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms of the gnu general public license version 2 and
only version 2 as published by the free software foundation this
program is distributed in the hope that it will be useful but
without any warranty without even the implied warranty of
merchantability or fitness for a particular purpose see the gnu
general public license for more details
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 294 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190529141900.825281744@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
usbphy nodes do not have any register properties and thus
shouldn't be placed inside the bus.
Move usbphy nodes from soc node to root node in order to fix
the following build warnings with W=1:
arch/arm64/boot/dts/freescale/imx8mm.dtsi:681.27-687.6: Warning (simple_bus_reg): /soc/bus@32c00000/usbphynop1: missing or empty reg/ranges property
arch/arm64/boot/dts/freescale/imx8mm.dtsi:710.27-716.6: Warning (simple_bus_reg): /soc/bus@32c00000/usbphynop2: missing or empty reg/ranges property
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Pass the 'ranges' property for each one of the AIPS bus in order
to fix the following build warnings:
arch/arm64/boot/dts/freescale/imx8mm.dtsi:209.23-388.5: Warning (unit_address_vs_reg): /soc/bus@30000000: node has a unit name, but
no reg property
arch/arm64/boot/dts/freescale/imx8mm.dtsi:390.23-439.5: Warning (unit_address_vs_reg): /soc/bus@30400000: node has a unit name, but
no reg property
arch/arm64/boot/dts/freescale/imx8mm.dtsi:441.23-658.5: Warning (unit_address_vs_reg): /soc/bus@30800000: node has a unit name, but
no reg property
arch/arm64/boot/dts/freescale/imx8mm.dtsi:660.23-724.5: Warning (unit_address_vs_reg): /soc/bus@32c00000: node has a unit name, but
no reg property
This also aligns with imx8mq.dtsi.
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
The 'soc' name needs a unit name to match its 'ranges' property.
Pass the unit name in order to fix the following dtc build warning
with W=1:
arch/arm64/boot/dts/freescale/imx8mm.dtsi:203.6-754.4: Warning (unit_address_vs_reg): /soc: node has a reg or ranges property, but no unit name
This also aligns with imx8mq.dtsi.
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Add a node for the snvs power key, "disabled" by default.
Signed-off-by: Angus Ainslie (Purism) <angus@akkea.ca>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
