Files
android_kernel_xiaomi_sm8450/arch/x86/kernel
Len Brown 7745f03eb3 x86/topology: Add CPUID.1F multi-die/package support
Some new systems have multiple software-visible die within each package.

Update Linux parsing of the Intel CPUID "Extended Topology Leaf" to handle
either CPUID.B, or the new CPUID.1F.

Add cpuinfo_x86.die_id and cpuinfo_x86.max_dies to store the result.

die_id will be non-zero only for multi-die/package systems.

Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: linux-doc@vger.kernel.org
Link: https://lkml.kernel.org/r/7b23d2d26d717b8e14ba137c94b70943f1ae4b5c.1557769318.git.len.brown@intel.com
2019-05-23 10:08:30 +02:00
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