To be able to check and set bad block markers in the first and
second page of a block independently of each other, we create
separate flags for both cases.
Previously NAND_BBM_SECONDPAGE meant, that both, the first and the
second page were used. With this patch NAND_BBM_FIRSTPAGE stands for
using the first page and NAND_BBM_SECONDPAGE for using the second
page.
This patch is only for preparation of subsequent changes and does
not implement the logic to actually handle both flags separately.
Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Reviewed-by: Boris Brezillon <bbrezillon@kernel.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The information about where the manufacturer puts the bad block
markers inside the bad block and in the OOB data is stored in
different places. Let's move this information to nand_chip.options
and nand_chip.badblockpos.
As this chip-specific information is not directly related to the
bad block table (BBT), we also rename the flags to NAND_BBM_*.
Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
nand_device embeds a nand_ecc_req object which contains the minimum
strength and step-size required by the NAND device.
Drop the chip->ecc_{strength,step}_ds fields and use
chip->base.eccreq.{strength,step_size} instead.
Signed-off-by: Boris Brezillon <bbrezillon@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
If we want to use the generic NAND layer, we need to have the memorg
struct appropriately filled. Patch the detection code to fill this
struct.
Signed-off-by: Boris Brezillon <bbrezillon@kernel.org>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Now that most of the raw NAND API is consistent and has almost all its
helpers and hooks using a single nand_chip object instead of an mtd_info
one (or both), let's do the same cleanup in the raw NAND vendors
drivers.
Apply this change to the Toshiba driver so that the internal helper to
retrieve the ECC status does only take a nand_chip object.
Suggested-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Reviewed-by: Boris Brezillon <boris.brezillon@bootlin.com>
A lot of things defined in rawnand.h should not be exposed to NAND
controller drivers and should only be shared by core files.
Create the drivers/mtd/nand/raw/internals.h header to store such
definitions, and move all private defs to this header.
Also remove EXPORT_SYMBOLS() on functions that are not supposed to be
exposed.
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Let's make the raw NAND API consistent by patching all helpers and
hooks to take a nand_chip object instead of an mtd_info one or
remove the mtd_info object when both are passed.
Let's tackle all ecc->read_xxx() hooks at once.
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Acked-by: Stefan Agner <stefan@agner.ch>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
This patch is a patch to support TOSHIBA MEMORY CORPORATION BENAND
memory devices. Check the status of the built-in ECC with the Read
Status command without using the vendor specific command. The Read
Status command only knows whether there was bitflips above the
threshold and can not get accurate bitflips. For now, I set
max_bitflips mtd->bitflip_threshold.
Signed-off-by: KOBAYASHI Yoshitake <yoshitake.kobayashi@toshiba.co.jp>
Reviewed-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
As part of the process of sharing more code between different NAND
based devices, we need to move all raw NAND related code to the raw/
subdirectory.
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
