Pull thermal SoC updates from Eduardo Valentin:
"Several new things coming up. Specifics:
- Rework of tsens and hisi thermal drivers
- OF-thermal now allows sharing multiple cooling devices on maps
- Added support for r8a7744 and R8A77970 on rcar thermal driver
- Added support for r8a774a1 on rcar_gen3 thermal driver
- New thermal driver stm32
- Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada,
qcom-spmi, rcar, da9062/61"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits)
thermal: da9062/61: Prevent hardware access during system suspend
thermal: rcar_thermal: Prevent doing work after unbind
thermal: rcar_thermal: Prevent hardware access during system suspend
thermal: rcar_gen3_thermal: add R8A77980 support
dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings
thermal: add stm32 thermal driver
dt-bindings: stm32-thermal: add binding documentation
thermal: rcar_thermal: add R8A77970 support
dt-bindings: thermal: rcar-thermal: document R8A77970 bindings
thermal: rcar_thermal: fix duplicate IRQ request
dt-bindings: thermal: rcar: Add device tree support for r8a7744
thermal/drivers/hisi: Add the dual clusters sensors for hi3660
thermal/drivers/hisi: Add more sensors channel
thermal/drivers/hisi: Remove pointless irq field
thermal/drivers/hisi: Use platform_get_irq_byname
thermal/drivers/hisi: Replace macro name with relevant sensor location
thermal/drivers/hisi: Add multiple sensors support
thermal/drivers/hisi: Prepare to support multiple sensors
thermal/drivers/hisi: Factor out the probe functions
thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer
...
The initialization sequence for H3 (r8a7795) ES1.x and ES2.0 is
different. H3 ES2.0 and later uses the same sequence as M3 (r8a7796)
ES1.0. Fix this by not looking at compatible strings and instead
defaulting to the r8a7796 initialization sequence and use
soc_device_match() to check for H3 ES1.x.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const. Thus the thermal_zone_of_device_ops structure itself can
be const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
To restore operation it's easiest to reinitialise all TSCs. In order to
do this the current trip window needs to be stored in the TSC structure
so that it can be restored upon resume.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Enable hardware trip points by implementing the set_trips callback. The
thermal core will take care of setting the initial trip point window and
to update it once the driver reports a TSC has moved outside it.
The interrupt structure for this device is a bit odd. There is not a
dedicated IRQ for each TSC, instead the interrupts are shared between
all TSCs. IRQn is fired if the temp monitored in IRQTEMPn is reached in
any of the TSCs, example IRQ3 is fired if temperature in IRQTEMP3 is
reached in either TSC0, TSC1 or TSC2.
For this reason the usage of interrupts in this driver is an all-on or
all-off design. When an interrupt happens all TSCs are checked and all
thermal zones are updated. This could be refined to be more fine grained
but the thermal core takes care of only updating the thermal zones that
have left their trip point window.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The .thermal_init needs to be delayed a short amount of time to allow
for the TEMP register to contain something useful. If it's not delayed
these warnings are common during boot:
thermal thermal_zone0: failed to read out thermal zone (-5)
thermal thermal_zone1: failed to read out thermal zone (-5)
thermal thermal_zone2: failed to read out thermal zone (-5)
The warnings are triggered by the first call to .get_temp() while the
TEMP register contains 0 and rcar_gen3_thermal_get_temp() returns -EIO
since a TEMP value of 0 will result in a temperature reading which is
out of specifications.
This should have been done in the initial commit which adds the driver
as the same issue was found and corrected for r8a7795.
Fixes: 564e73d283 ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
