The new generic NAND ECC framework stores the configuration and
requirements in separate places since commit 93ef92f6f4 ("mtd: nand: Use
the new generic ECC object"). In 5.10.x The SPI NAND layer still uses only
the requirements to track the ECC properties. This mismatch leads to
values of zero being used for ECC strength and step_size in the SPI NAND
layer wherever nanddev_get_ecc_conf() is used and therefore breaks the SPI
NAND on-die ECC support in 5.10.x.
By using nanddev_get_ecc_requirements() instead of nanddev_get_ecc_conf()
for SPI NAND, we make sure that the correct parameters for the detected
chip are used. In later versions (5.11.x) this is fixed anyway with the
implementation of the SPI NAND on-die ECC engine.
Cc: stable@vger.kernel.org # 5.10.x
Reported-by: voice INTER connect GmbH <developer@voiceinterconnect.de>
Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Acked-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
The suffix was changed from "G" to "J" to classify between 1st generation
and 2nd generation serial NAND devices (which now belong to the Kioxia
brand).
As reference that's
1st generation device of 1Gbit product is "TC58CVG0S3HRAIG"
2nd generation device of 1Gbit product is "TC58CVG0S3HRAIJ".
The 8Gbit type "TH58CxG3S0HRAIJ" is new to Kioxia's serial NAND lineup and
the prefix was changed from "TC58" to "TH58".
Thus the functions were renamed from tc58cxgxsx_*() to tx58cxgxsxraix_*().
Signed-off-by: Yoshio Furuyama <ytc-mb-yfuruyama7@kioxia.com>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/0dedd9869569a17625822dba87878254d253ba0e.1584949601.git.ytc-mb-yfuruyama7@kioxia.com
Currently there are 3 different variants of read_id implementation:
1. opcode only. Found in GD5FxGQ4xF.
2. opcode + 1 addr byte. Found in GD5GxGQ4xA/E
3. opcode + 1 dummy byte. Found in other currently supported chips.
Original implementation was for variant 1 and let detect function
of chips with variant 2 and 3 to ignore the first byte. This isn't
robust:
1. For chips of variant 2, if SPI master doesn't keep MOSI low
during read, chip will get a random id offset, and the entire id
buffer will shift by that offset, causing detect failure.
2. For chips of variant 1, if it happens to get a devid that equals
to manufacture id of variant 2 or 3 chips, it'll get incorrectly
detected.
This patch reworks detect procedure to address problems above. New
logic do detection for all variants separatedly, in 1-2-3 order.
Since all current detect methods do exactly the same id matching
procedure, unify them into core.c and remove detect method from
manufacture_ops.
Tested on GD5F1GQ4UAYIG and W25N01GVZEIG.
Signed-off-by: Chuanhong Guo <gch981213@gmail.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20200208074439.146296-1-gch981213@gmail.com
NAND datasheets usually give the maximum number of bad blocks per LUN
and this number can be used to help upper layers decide how much blocks
they should reserve for bad block handling.
Add a max_bad_eraseblocks_per_lun to the nand_memory_organization
struct and update the NAND_MEMORG() macro (and its users) accordingly.
We also provide a default mtd->_max_bad_blocks() implementation.
Signed-off-by: Boris Brezillon <bbrezillon@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
