Sergey Vidishev
11700fcb90
Documentation: cpu-idle-cooling: Fix diagram for 33% duty cycle
...
Signed-off-by: Sergey Vidishev <sergeyv@yandex-team.ru >
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org >
Link: https://lore.kernel.org/r/2374188.AZIXMmL6Zy@sergeyv-box
2020-04-07 10:45:15 +02:00
Randy Dunlap
fe27f13d67
Documentation: cpu-idle-cooling: fix a SEVERE docs build failure
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Sphinx ('make htmldocs') stops with a SEVERE error:
Sphinx parallel build error:
SystemMessage: /home/rdunlap/lnx/next/linux-next-20200120/Documentation/driver-api/thermal/cpu-idle-cooling.rst:69: (SEVERE/4) Unexpected section title.
^
|
so fix the .rst file so that the SEVERE build error does not happen.
Also fix another minor formatting warning (unexpected unindent).
Signed-off-by: Randy Dunlap <rdunlap@infradead.org >
Cc: Zhang Rui <rui.zhang@intel.com >
Cc: Daniel Lezcano <daniel.lezcano@linaro.org >
Cc: Amit Kucheria <amit.kucheria@verdurent.com >
Cc: linux-pm@vger.kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org >
Link: https://lore.kernel.org/r/712c1152-56b5-307f-b3f3-ed03a30b804a@infradead.org
2020-01-31 10:50:33 +01:00
Krzysztof Kozlowski
ca07ee4e3d
thermal: exynos: Rename Samsung and Exynos to lowercase
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Fix up inconsistent usage of upper and lowercase letters in "Samsung"
and "Exynos" names.
"SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked
names. Therefore they should be written with lowercase letters starting
with capital letter.
The lowercase "Exynos" name is promoted by its manufacturer Samsung
Electronics Co., Ltd., in advertisement materials and on website.
Although advertisement materials usually use uppercase "SAMSUNG", the
lowercase version is used in all legal aspects (e.g. on Wikipedia and in
privacy/legal statements on
https://www.samsung.com/semiconductor/privacy-global/ ).
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org >
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org >
Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
2020-01-27 10:24:32 +01:00
Daniel Lezcano
23affa2e29
thermal/drivers/cpu_cooling: Rename to cpufreq_cooling
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As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org >
Acked-by: Viresh Kumar <viresh.kumar@linaro.org >
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org >
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
2020-01-27 10:24:32 +01:00
Daniel Lezcano
0a1990a2d1
thermal/drivers/cpu_cooling: Add idle cooling device documentation
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Provide some documentation for the idle injection cooling effect in
order to let people to understand the rational of the approach for the
idle injection CPU cooling device.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org >
Acked-by: Viresh Kumar <viresh.kumar@linaro.org >
Link: https://lore.kernel.org/r/20191219225317.17158-1-daniel.lezcano@linaro.org
2020-01-27 10:24:32 +01:00
Amit Kucheria
f96c8e5015
thermal: Remove netlink support
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There are no users of netlink messages for thermal inside the kernel.
Remove the code and adjust the documentation.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org >
Acked-by: Viresh Kumar <viresh.kumar@linaro.org >
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org >
Link: https://lore.kernel.org/r/8ff02cf62186c7a54fff325fad40a2e9ca3affa6.1571656014.git.amit.kucheria@linaro.org
2019-11-07 07:00:26 +01:00
Mauro Carvalho Chehab
eaf7b46083
docs: thermal: add it to the driver API
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The file contents mostly describes driver internals.
Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org >
Signed-off-by: Jonathan Corbet <corbet@lwn.net >
2019-07-31 13:25:15 -06:00
