USB: OHCI: DA8xx/OMAP-L1x glue layer

Texas Instruments DA8xx/OMAP-L1x OHCI glue layer.

This OHCI implementation is not without quirks: there's only one physical port
despite the root hub reporting two; the port's power control and over-current
status bits are not connected to any pins, however, at least on the DA830 EVM
board, those signals are connected via GPIO, thus the provision was made for
overriding the OHCI port power and over-current bits at the board level...

Signed-off-by: Mikhail Cherkashin <mcherkashin@ru.mvista.com>
Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
This commit is contained in:
Sergei Shtylyov
2010-02-12 23:52:34 +04:00
committed by Greg Kroah-Hartman
parent bdee2d8432
commit efe7daf223
3 changed files with 462 additions and 0 deletions

View File

@@ -40,6 +40,7 @@ config USB_ARCH_HAS_OHCI
default y if ARCH_PNX4008 && I2C
default y if MFD_TC6393XB
default y if ARCH_W90X900
default y if ARCH_DAVINCI_DA8XX
# PPC:
default y if STB03xxx
default y if PPC_MPC52xx