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thermal: db8500: Finalize device tree conversion

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At some point there was an attempt to convert the DB8500
thermal sensor to device tree: a probe path was added
and the device tree was augmented for the Snowball board.
The switchover was never completed: instead the thermal
devices came from from the PRCMU MFD device and the probe
on the Snowball was confused as another set of configuration
appeared from the device tree.

Move over to a device-tree only approach, as we fixed up
the device trees.

Cc: Vincent Guittot <vincent.guittot@linaro.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This commit is contained in:
Linus Walleij
2019-08-28 15:03:18 +02:00
committed by Eduardo Valentin
parent dd89d82e75
commit cb063a83ca
4 changed files with 17 additions and 97 deletions
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29
include/linux/platform_data/db8500_thermal.h
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@@ -1,29 +0,0 @@
/* SPDX-License-Identifier: GPL-2.0-or-later */
/*
* db8500_thermal.h - DB8500 Thermal Management Implementation
*
* Copyright (C) 2012 ST-Ericsson
* Copyright (C) 2012 Linaro Ltd.
*
* Author: Hongbo Zhang <hongbo.zhang@linaro.com>
*/
#ifndef _DB8500_THERMAL_H_
#define _DB8500_THERMAL_H_
#include <linux/thermal.h>
#define COOLING_DEV_MAX 8
struct db8500_trip_point {
unsigned long temp;
enum thermal_trip_type type;
char cdev_name[COOLING_DEV_MAX][THERMAL_NAME_LENGTH];
};
struct db8500_thsens_platform_data {
struct db8500_trip_point trip_points[THERMAL_MAX_TRIPS];
int num_trips;
};
#endif /* _DB8500_THERMAL_H_ */