Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal

Pull thermal SoC updates from Eduardo Valentin:
 "This is a really small pull in the midst of a lot of pending patches.

  We are in the middle of restructuring how we are maintaining the
  thermal subsystem, as per discussion in our last LPC. For now, I am
  sending just some changes that were pending in my tree. Looking
  forward to get a more streamlined process in the next merge window"

* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
  thermal: db8500: Rewrite to be a pure OF sensor
  thermal: db8500: Use dev helper variable
  thermal: db8500: Finalize device tree conversion
  thermal: thermal_mmio: remove some dead code
This commit is contained in:
Linus Torvalds
2019-09-29 10:24:23 -07:00
5 changed files with 114 additions and 463 deletions

View File

@@ -1,29 +0,0 @@
/* SPDX-License-Identifier: GPL-2.0-or-later */
/*
* db8500_thermal.h - DB8500 Thermal Management Implementation
*
* Copyright (C) 2012 ST-Ericsson
* Copyright (C) 2012 Linaro Ltd.
*
* Author: Hongbo Zhang <hongbo.zhang@linaro.com>
*/
#ifndef _DB8500_THERMAL_H_
#define _DB8500_THERMAL_H_
#include <linux/thermal.h>
#define COOLING_DEV_MAX 8
struct db8500_trip_point {
unsigned long temp;
enum thermal_trip_type type;
char cdev_name[COOLING_DEV_MAX][THERMAL_NAME_LENGTH];
};
struct db8500_thsens_platform_data {
struct db8500_trip_point trip_points[THERMAL_MAX_TRIPS];
int num_trips;
};
#endif /* _DB8500_THERMAL_H_ */