Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: - Thermal core code reorganization and cleanup. Two new files are created for thermal sysfs I/F code and thermal helper functions (Eduardo Valentin). - Sanitize hotplug and locking for x86_pkg_temp driver (Thomas Gleixner) - Update MAINTAINER file for pwm-fan driver and Samsung thermal driver (Lukasz Majewski) - Fix module auto-load for max77620, tango and db8500 thermal driver (Javier Martinez Canillas) - Fix a bug that thermal hwmon sysfs I/F returns wrong critical trip point temperature value (Krzysztof Kozlowski) - Add Skylake PCH 100 series support for intel_pch_thermal driver (OGAWA Hirofumi) - Small fixes and cleanups for platform thermal drivers (Julia Lawall, Luis Henriques, Leo Yan, Stephen Boyd, Shawn Lin, Javi Merino and Lukasz Luba) * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (76 commits) MAINTAINERS: Samsung: Update maintainer for PWM FAN and SAMSUNG THERMAL thermal/x86 pkg temp: Convert to hotplug state machine thermal/x86_pkg_temp: Sanitize package management thermal/x86_pkg_temp: Move work into package struct thermal/x86_pkg_temp: Move work scheduled flag into package struct thermal/x86_pkg_temp: Sanitize locking thermal/x86_pkg_temp: Cleanup code some more thermal/x86_pkg_temp: Cleanup namespace thermal/x86_pkg_temp: Get rid of ref counting thermal/x86_pkg_temp: Sanitize callback (de)initialization thermal/x86_pkg_temp: Replace open coded cpu search thermal/x86_pkg_temp: Remove redundant package search thermal/x86_pkg_temp: Cleanup thermal interrupt handling thermal: hwmon: Properly report critical temperature in sysfs devfreq_cooling: pass a pointer to devfreq in the power model callbacks devfreq_cooling: make the structs devfreq_cooling_xxx visible for all dt-bindings: rockchip-thermal: fix the misleading description thermal: rockchip: improve the warning log thermal: db8500: Fix module autoload thermal: tango: Fix module autoload ...
这个提交包含在:
@@ -20,7 +20,6 @@
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#include <linux/devfreq.h>
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#include <linux/thermal.h>
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#ifdef CONFIG_DEVFREQ_THERMAL
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/**
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* struct devfreq_cooling_power - Devfreq cooling power ops
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@@ -37,12 +36,16 @@
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* @dyn_power_coeff * frequency * voltage^2
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*/
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struct devfreq_cooling_power {
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unsigned long (*get_static_power)(unsigned long voltage);
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unsigned long (*get_dynamic_power)(unsigned long freq,
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unsigned long (*get_static_power)(struct devfreq *devfreq,
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unsigned long voltage);
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unsigned long (*get_dynamic_power)(struct devfreq *devfreq,
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unsigned long freq,
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unsigned long voltage);
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unsigned long dyn_power_coeff;
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};
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#ifdef CONFIG_DEVFREQ_THERMAL
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struct thermal_cooling_device *
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of_devfreq_cooling_register_power(struct device_node *np, struct devfreq *df,
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struct devfreq_cooling_power *dfc_power);
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@@ -28,6 +28,7 @@
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#include <linux/of.h>
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#include <linux/idr.h>
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#include <linux/device.h>
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#include <linux/sysfs.h>
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#include <linux/workqueue.h>
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#include <uapi/linux/thermal.h>
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@@ -204,6 +205,7 @@ struct thermal_zone_device {
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int id;
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char type[THERMAL_NAME_LENGTH];
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struct device device;
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struct attribute_group trips_attribute_group;
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struct thermal_attr *trip_temp_attrs;
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struct thermal_attr *trip_type_attrs;
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struct thermal_attr *trip_hyst_attrs;
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