Merge branches 'thermal-core', 'thermal-intel' and 'thermal-soc' into next

This commit is contained in:
Zhang Rui
2015-11-06 09:32:10 +08:00
17 changed files with 1043 additions and 67 deletions

View File

@@ -147,6 +147,20 @@ config CLOCK_THERMAL
device that is configured to use this cooling mechanism will be
controlled to reduce clock frequency whenever temperature is high.
config DEVFREQ_THERMAL
bool "Generic device cooling support"
depends on PM_DEVFREQ
depends on PM_OPP
help
This implements the generic devfreq cooling mechanism through
frequency reduction for devices using devfreq.
This will throttle the device by limiting the maximum allowed DVFS
frequency corresponding to the cooling level.
In order to use the power extensions of the cooling device,
devfreq should use the simple_ondemand governor.
If you want this support, you should say Y here.
config THERMAL_EMULATION
@@ -275,6 +289,7 @@ config X86_PKG_TEMP_THERMAL
tristate "X86 package temperature thermal driver"
depends on X86_THERMAL_VECTOR
select THERMAL_GOV_USER_SPACE
select THERMAL_WRITABLE_TRIPS
default m
help
Enable this to register CPU digital sensor for package temperature as
@@ -296,6 +311,7 @@ config INTEL_SOC_DTS_THERMAL
tristate "Intel SoCs DTS thermal driver"
depends on X86
select INTEL_SOC_DTS_IOSF_CORE
select THERMAL_WRITABLE_TRIPS
help
Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
temperature sensor (DTS). These SoCs have two additional DTSs in
@@ -322,6 +338,7 @@ config INT340X_THERMAL
select ACPI_THERMAL_REL
select ACPI_FAN
select INTEL_SOC_DTS_IOSF_CORE
select THERMAL_WRITABLE_TRIPS
help
Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core