Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management update from Zhang Rui: "Highlights: - Introduction of thermal policy support, together with three new thermal governors, including step_wise, user_space, fire_share. - Introduction of ST-Ericsson db8500_thermal driver and ST-Ericsson db8500_cpufreq_cooling driver. - Thermal Kconfig file and Makefile refactor. - Fixes for generic thermal layer, generic cpucooling, rcar thermal driver and Exynos thermal driver." * 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits) Thermal: Fix DEFAULT_THERMAL_GOVERNOR Thermal: fix a NULL pointer dereference when generic thermal layer is built as a module thermal: rcar: add rcar_zone_to_priv() macro thermal: rcar: fixup the unit of temperature thermal: cpu cooling: allow module builds thermal: cpu cooling: use const parameter while registering Thermal: Add ST-Ericsson DB8500 thermal properties and platform data. Thermal: Add ST-Ericsson DB8500 thermal driver. drivers/thermal/Makefile refactor Exynos: Add missing dependency Refactor drivers/thermal/Kconfig thermal: cpu_cooling: Make 'notify_device' static Thermal: Remove the cooling_cpufreq_list. Thermal: fix bug of counting cpu frequencies. Thermal: add indent for code alignment. thermal: rcar_thermal: remove explicitly used devm_kfree/iounap() thermal: user_space: Add missing static storage class specifiers thermal: fair_share: Add missing static storage class specifiers thermal: step_wise: Add missing static storage class specifiers Thermal: Fix oops and unlocking in thermal_sys.c ...
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Documentation/devicetree/bindings/thermal/db8500-thermal.txt
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44
Documentation/devicetree/bindings/thermal/db8500-thermal.txt
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* ST-Ericsson DB8500 Thermal
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** Thermal node properties:
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- compatible : "stericsson,db8500-thermal";
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- reg : address range of the thermal sensor registers;
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- interrupts : interrupts generated from PRCMU;
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- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH";
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- num-trips : number of total trip points, this is required, set it 0 if none,
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if greater than 0, the following properties must be defined;
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- tripN-temp : temperature of trip point N, should be in ascending order;
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- tripN-type : type of trip point N, should be one of "active" "passive" "hot"
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"critical";
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- tripN-cdev-num : number of the cooling devices which can be bound to trip
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point N, this is required if trip point N is defined, set it 0 if none,
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otherwise the following cooling device names must be defined;
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- tripN-cdev-nameM : name of the No. M cooling device of trip point N;
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Usually the num-trips and tripN-*** are separated in board related dts files.
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Example:
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thermal@801573c0 {
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compatible = "stericsson,db8500-thermal";
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reg = <0x801573c0 0x40>;
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interrupts = <21 0x4>, <22 0x4>;
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interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";
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num-trips = <3>;
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trip0-temp = <75000>;
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trip0-type = "active";
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trip0-cdev-num = <1>;
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trip0-cdev-name0 = "thermal-cpufreq-0";
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trip1-temp = <80000>;
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trip1-type = "active";
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trip1-cdev-num = <2>;
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trip1-cdev-name0 = "thermal-cpufreq-0";
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trip1-cdev-name1 = "thermal-fan";
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trip2-temp = <85000>;
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trip2-type = "critical";
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trip2-cdev-num = <0>;
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}
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