Kconfig 16 KB

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  1. # SPDX-License-Identifier: GPL-2.0-only
  2. #
  3. # Generic thermal drivers configuration
  4. #
  5. menuconfig THERMAL
  6. bool "Thermal drivers"
  7. help
  8. Thermal drivers offer a generic mechanism for
  9. thermal management. Usually it's made up of one or more thermal
  10. zones and cooling devices.
  11. Each thermal zone contains its own temperature, trip points,
  12. and cooling devices.
  13. All platforms with ACPI or Open Firmware thermal support can use
  14. this driver.
  15. If you want this support, you should say Y here.
  16. if THERMAL
  17. config THERMAL_NETLINK
  18. bool "Thermal netlink management"
  19. depends on NET
  20. help
  21. The thermal framework has a netlink interface to do thermal
  22. zones discovery, temperature readings and events such as
  23. trip point crossed, cooling device update or governor
  24. change. It is recommended to enable the feature.
  25. config THERMAL_STATISTICS
  26. bool "Thermal state transition statistics"
  27. help
  28. Export thermal state transition statistics information through sysfs.
  29. If in doubt, say N.
  30. config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
  31. int "Emergency poweroff delay in milli-seconds"
  32. default 0
  33. help
  34. Thermal subsystem will issue a graceful shutdown when
  35. critical temperatures are reached using orderly_poweroff(). In
  36. case of failure of an orderly_poweroff(), the thermal emergency
  37. poweroff kicks in after a delay has elapsed and shuts down the system.
  38. This config is number of milliseconds to delay before emergency
  39. poweroff kicks in. Similarly to the critical trip point,
  40. the delay should be carefully profiled so as to give adequate
  41. time for orderly_poweroff() to finish on regular execution.
  42. If set to 0 emergency poweroff will not be supported.
  43. In doubt, leave as 0.
  44. config THERMAL_HWMON
  45. bool
  46. prompt "Expose thermal sensors as hwmon device"
  47. depends on HWMON=y || HWMON=THERMAL
  48. default y
  49. help
  50. In case a sensor is registered with the thermal
  51. framework, this option will also register it
  52. as a hwmon. The sensor will then have the common
  53. hwmon sysfs interface.
  54. Say 'Y' here if you want all thermal sensors to
  55. have hwmon sysfs interface too.
  56. config THERMAL_OF
  57. bool
  58. prompt "APIs to parse thermal data out of device tree"
  59. depends on OF
  60. default y
  61. help
  62. This options provides helpers to add the support to
  63. read and parse thermal data definitions out of the
  64. device tree blob.
  65. Say 'Y' here if you need to build thermal infrastructure
  66. based on device tree.
  67. config THERMAL_WRITABLE_TRIPS
  68. bool "Enable writable trip points"
  69. help
  70. This option allows the system integrator to choose whether
  71. trip temperatures can be changed from userspace. The
  72. writable trips need to be specified when setting up the
  73. thermal zone but the choice here takes precedence.
  74. Say 'Y' here if you would like to allow userspace tools to
  75. change trip temperatures.
  76. choice
  77. prompt "Default Thermal governor"
  78. default THERMAL_DEFAULT_GOV_STEP_WISE
  79. help
  80. This option sets which thermal governor shall be loaded at
  81. startup. If in doubt, select 'step_wise'.
  82. config THERMAL_DEFAULT_GOV_STEP_WISE
  83. bool "step_wise"
  84. select THERMAL_GOV_STEP_WISE
  85. help
  86. Use the step_wise governor as default. This throttles the
  87. devices one step at a time.
  88. config THERMAL_DEFAULT_GOV_FAIR_SHARE
  89. bool "fair_share"
  90. select THERMAL_GOV_FAIR_SHARE
  91. help
  92. Use the fair_share governor as default. This throttles the
  93. devices based on their 'contribution' to a zone. The
  94. contribution should be provided through platform data.
  95. config THERMAL_DEFAULT_GOV_USER_SPACE
  96. bool "user_space"
  97. select THERMAL_GOV_USER_SPACE
  98. help
  99. The Userspace governor allows to get trip point crossed
  100. notification from the kernel via uevents. It is recommended
  101. to use the netlink interface instead which gives richer
  102. information about the thermal framework events.
  103. config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  104. bool "power_allocator"
  105. depends on THERMAL_GOV_POWER_ALLOCATOR
  106. help
  107. Select this if you want to control temperature based on
  108. system and device power allocation. This governor can only
  109. operate on cooling devices that implement the power API.
  110. endchoice
  111. config THERMAL_GOV_FAIR_SHARE
  112. bool "Fair-share thermal governor"
  113. help
  114. Enable this to manage platform thermals using fair-share governor.
  115. config THERMAL_GOV_STEP_WISE
  116. bool "Step_wise thermal governor"
  117. help
  118. Enable this to manage platform thermals using a simple linear
  119. governor.
  120. config THERMAL_GOV_BANG_BANG
  121. bool "Bang Bang thermal governor"
  122. default n
  123. help
  124. Enable this to manage platform thermals using bang bang governor.
  125. Say 'Y' here if you want to use two point temperature regulation
  126. used for fans without throttling. Some fan drivers depend on this
  127. governor to be enabled (e.g. acerhdf).
  128. config THERMAL_GOV_USER_SPACE
  129. bool "User_space thermal governor"
  130. help
  131. Enable this to let the user space manage the platform thermals.
  132. config THERMAL_GOV_POWER_ALLOCATOR
  133. bool "Power allocator thermal governor"
  134. depends on ENERGY_MODEL
  135. help
  136. Enable this to manage platform thermals by dynamically
  137. allocating and limiting power to devices.
  138. config CPU_THERMAL
  139. bool "Generic cpu cooling support"
  140. depends on THERMAL_OF
  141. help
  142. Enable the CPU cooling features. If the system has no active
  143. cooling device available, this option allows to use the CPU
  144. as a cooling device.
  145. if CPU_THERMAL
  146. config CPU_FREQ_THERMAL
  147. bool "CPU frequency cooling device"
  148. depends on CPU_FREQ
  149. default y
  150. help
  151. This implements the generic cpu cooling mechanism through frequency
  152. reduction. An ACPI version of this already exists
  153. (drivers/acpi/processor_thermal.c).
  154. This will be useful for platforms using the generic thermal interface
  155. and not the ACPI interface.
  156. config CPU_IDLE_THERMAL
  157. bool "CPU idle cooling device"
  158. depends on IDLE_INJECT
  159. help
  160. This implements the CPU cooling mechanism through
  161. idle injection. This will throttle the CPU by injecting
  162. idle cycle.
  163. endif
  164. config DEVFREQ_THERMAL
  165. bool "Generic device cooling support"
  166. depends on PM_DEVFREQ
  167. depends on PM_OPP
  168. help
  169. This implements the generic devfreq cooling mechanism through
  170. frequency reduction for devices using devfreq.
  171. This will throttle the device by limiting the maximum allowed DVFS
  172. frequency corresponding to the cooling level.
  173. In order to use the power extensions of the cooling device,
  174. devfreq should use the simple_ondemand governor.
  175. If you want this support, you should say Y here.
  176. config THERMAL_EMULATION
  177. bool "Thermal emulation mode support"
  178. help
  179. Enable this option to make a emul_temp sysfs node in thermal zone
  180. directory to support temperature emulation. With emulation sysfs node,
  181. user can manually input temperature and test the different trip
  182. threshold behaviour for simulation purpose.
  183. WARNING: Be careful while enabling this option on production systems,
  184. because userland can easily disable the thermal policy by simply
  185. flooding this sysfs node with low temperature values.
  186. config THERMAL_MMIO
  187. tristate "Generic Thermal MMIO driver"
  188. depends on OF
  189. depends on HAS_IOMEM
  190. help
  191. This option enables the generic thermal MMIO driver that will use
  192. memory-mapped reads to get the temperature. Any HW/System that
  193. allows temperature reading by a single memory-mapped reading, be it
  194. register or shared memory, is a potential candidate to work with this
  195. driver.
  196. config HISI_THERMAL
  197. tristate "Hisilicon thermal driver"
  198. depends on ARCH_HISI || COMPILE_TEST
  199. depends on HAS_IOMEM
  200. depends on OF
  201. default y
  202. help
  203. Enable this to plug hisilicon's thermal sensor driver into the Linux
  204. thermal framework. cpufreq is used as the cooling device to throttle
  205. CPUs when the passive trip is crossed.
  206. config IMX_THERMAL
  207. tristate "Temperature sensor driver for Freescale i.MX SoCs"
  208. depends on ARCH_MXC || COMPILE_TEST
  209. depends on NVMEM || !NVMEM
  210. depends on MFD_SYSCON
  211. depends on OF
  212. help
  213. Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
  214. It supports one critical trip point and one passive trip point. The
  215. cpufreq is used as the cooling device to throttle CPUs when the
  216. passive trip is crossed.
  217. config IMX_SC_THERMAL
  218. tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
  219. depends on IMX_SCU
  220. depends on OF
  221. help
  222. Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
  223. system controller inside, Linux kernel has to communicate with system
  224. controller via MU (message unit) IPC to get temperature from thermal
  225. sensor. It supports one critical trip point and one
  226. passive trip point for each thermal sensor.
  227. config IMX8MM_THERMAL
  228. tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
  229. depends on ARCH_MXC || COMPILE_TEST
  230. depends on OF
  231. help
  232. Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
  233. It supports one critical trip point and one passive trip point. The
  234. cpufreq is used as the cooling device to throttle CPUs when the passive
  235. trip is crossed.
  236. config K3_THERMAL
  237. tristate "Texas Instruments K3 thermal support"
  238. depends on ARCH_K3 || COMPILE_TEST
  239. help
  240. If you say yes here you get thermal support for the Texas Instruments
  241. K3 SoC family. The current chip supported is:
  242. - AM654
  243. This includes temperature reading functionality.
  244. config MAX77620_THERMAL
  245. tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
  246. depends on MFD_MAX77620
  247. depends on OF
  248. help
  249. Support for die junction temperature warning alarm for Maxim
  250. Semiconductor PMIC MAX77620 device. Device generates two alarm
  251. interrupts when PMIC die temperature cross the threshold of
  252. 120 degC and 140 degC.
  253. config QORIQ_THERMAL
  254. tristate "QorIQ Thermal Monitoring Unit"
  255. depends on THERMAL_OF && HAS_IOMEM
  256. depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
  257. select REGMAP_MMIO
  258. help
  259. Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
  260. It supports one critical trip point and one passive trip point. The
  261. cpufreq is used as the cooling device to throttle CPUs when the
  262. passive trip is crossed.
  263. config SPEAR_THERMAL
  264. tristate "SPEAr thermal sensor driver"
  265. depends on PLAT_SPEAR || COMPILE_TEST
  266. depends on HAS_IOMEM
  267. depends on OF
  268. help
  269. Enable this to plug the SPEAr thermal sensor driver into the Linux
  270. thermal framework.
  271. config SUN8I_THERMAL
  272. tristate "Allwinner sun8i thermal driver"
  273. depends on ARCH_SUNXI || COMPILE_TEST
  274. depends on HAS_IOMEM
  275. depends on NVMEM
  276. depends on OF
  277. depends on RESET_CONTROLLER
  278. help
  279. Support for the sun8i thermal sensor driver into the Linux thermal
  280. framework.
  281. To compile this driver as a module, choose M here: the
  282. module will be called sun8i-thermal.
  283. config ROCKCHIP_THERMAL
  284. tristate "Rockchip thermal driver"
  285. depends on ARCH_ROCKCHIP || COMPILE_TEST
  286. depends on RESET_CONTROLLER
  287. depends on HAS_IOMEM
  288. help
  289. Rockchip thermal driver provides support for Temperature sensor
  290. ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
  291. trip point. Cpufreq is used as the cooling device and will throttle
  292. CPUs when the Temperature crosses the passive trip point.
  293. config RCAR_THERMAL
  294. tristate "Renesas R-Car thermal driver"
  295. depends on ARCH_RENESAS || COMPILE_TEST
  296. depends on HAS_IOMEM
  297. help
  298. Enable this to plug the R-Car thermal sensor driver into the Linux
  299. thermal framework.
  300. config RCAR_GEN3_THERMAL
  301. tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver"
  302. depends on ARCH_RENESAS || COMPILE_TEST
  303. depends on HAS_IOMEM
  304. depends on OF
  305. help
  306. Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into
  307. the Linux thermal framework.
  308. config RZG2L_THERMAL
  309. tristate "Renesas RZ/G2L thermal driver"
  310. depends on ARCH_RENESAS || COMPILE_TEST
  311. depends on HAS_IOMEM
  312. depends on OF
  313. help
  314. Enable this to plug the RZ/G2L thermal sensor driver into the Linux
  315. thermal framework.
  316. config KIRKWOOD_THERMAL
  317. tristate "Temperature sensor on Marvell Kirkwood SoCs"
  318. depends on MACH_KIRKWOOD || COMPILE_TEST
  319. depends on HAS_IOMEM
  320. depends on OF
  321. help
  322. Support for the Kirkwood thermal sensor driver into the Linux thermal
  323. framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
  324. config DOVE_THERMAL
  325. tristate "Temperature sensor on Marvell Dove SoCs"
  326. depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
  327. depends on HAS_IOMEM
  328. depends on OF
  329. help
  330. Support for the Dove thermal sensor driver in the Linux thermal
  331. framework.
  332. config DB8500_THERMAL
  333. tristate "DB8500 thermal management"
  334. depends on MFD_DB8500_PRCMU && OF
  335. default y
  336. help
  337. Adds DB8500 thermal management implementation according to the thermal
  338. management framework. A thermal zone with several trip points will be
  339. created. Cooling devices can be bound to the trip points to cool this
  340. thermal zone if trip points reached.
  341. config ARMADA_THERMAL
  342. tristate "Marvell EBU Armada SoCs thermal management"
  343. depends on ARCH_MVEBU || COMPILE_TEST
  344. depends on HAS_IOMEM
  345. depends on OF
  346. help
  347. Enable this option if you want to have support for thermal management
  348. controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
  349. config DA9062_THERMAL
  350. tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
  351. depends on MFD_DA9062 || COMPILE_TEST
  352. depends on OF
  353. help
  354. Enable this for the Dialog Semiconductor thermal sensor driver.
  355. This will report PMIC junction over-temperature for one thermal trip
  356. zone.
  357. Compatible with the DA9062 and DA9061 PMICs.
  358. config MTK_THERMAL
  359. tristate "Temperature sensor driver for mediatek SoCs"
  360. depends on ARCH_MEDIATEK || COMPILE_TEST
  361. depends on HAS_IOMEM
  362. depends on NVMEM || NVMEM=n
  363. depends on RESET_CONTROLLER
  364. default y
  365. help
  366. Enable this option if you want to have support for thermal management
  367. controller present in Mediatek SoCs
  368. config AMLOGIC_THERMAL
  369. tristate "Amlogic Thermal Support"
  370. default ARCH_MESON
  371. depends on OF && ARCH_MESON
  372. help
  373. If you say yes here you get support for Amlogic Thermal
  374. for G12 SoC Family.
  375. This driver can also be built as a module. If so, the module will
  376. be called amlogic_thermal.
  377. menu "Intel thermal drivers"
  378. depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
  379. source "drivers/thermal/intel/Kconfig"
  380. endmenu
  381. menu "Broadcom thermal drivers"
  382. depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
  383. COMPILE_TEST
  384. source "drivers/thermal/broadcom/Kconfig"
  385. endmenu
  386. menu "Texas Instruments thermal drivers"
  387. depends on ARCH_HAS_BANDGAP || COMPILE_TEST
  388. depends on HAS_IOMEM
  389. source "drivers/thermal/ti-soc-thermal/Kconfig"
  390. endmenu
  391. menu "Samsung thermal drivers"
  392. depends on ARCH_EXYNOS || COMPILE_TEST
  393. source "drivers/thermal/samsung/Kconfig"
  394. endmenu
  395. menu "STMicroelectronics thermal drivers"
  396. depends on (ARCH_STI || ARCH_STM32) && OF
  397. source "drivers/thermal/st/Kconfig"
  398. endmenu
  399. source "drivers/thermal/tegra/Kconfig"
  400. config GENERIC_ADC_THERMAL
  401. tristate "Generic ADC based thermal sensor"
  402. depends on IIO
  403. help
  404. This enabled a thermal sysfs driver for the temperature sensor
  405. which is connected to the General Purpose ADC. The ADC channel
  406. is read via IIO framework and the channel information is provided
  407. to this driver. This driver reports the temperature by reading ADC
  408. channel and converts it to temperature based on lookup table.
  409. menu "Qualcomm thermal drivers"
  410. depends on (ARCH_QCOM && OF) || COMPILE_TEST
  411. source "drivers/thermal/qcom/Kconfig"
  412. endmenu
  413. config UNIPHIER_THERMAL
  414. tristate "Socionext UniPhier thermal driver"
  415. depends on ARCH_UNIPHIER || COMPILE_TEST
  416. depends on THERMAL_OF && MFD_SYSCON
  417. help
  418. Enable this to plug in UniPhier on-chip PVT thermal driver into the
  419. thermal framework. The driver supports CPU thermal zone temperature
  420. reporting and a couple of trip points.
  421. config SPRD_THERMAL
  422. tristate "Temperature sensor on Spreadtrum SoCs"
  423. depends on ARCH_SPRD || COMPILE_TEST
  424. help
  425. Support for the Spreadtrum thermal sensor driver in the Linux thermal
  426. framework.
  427. config KHADAS_MCU_FAN_THERMAL
  428. tristate "Khadas MCU controller FAN cooling support"
  429. depends on OF
  430. depends on MFD_KHADAS_MCU
  431. select MFD_CORE
  432. select REGMAP
  433. help
  434. If you say yes here you get support for the FAN controlled
  435. by the Microcontroller found on the Khadas VIM boards.
  436. endif